Who Visits?
Semiconductor Manufacturing (IDM & Foundry)
- Korean & Global IDMs, Foundries
Semiconductor Design (Fabless)
- Fabless & Design Houses
Packaging & Test (OSAT & Test)
- Korean & Global OSATs, Test Houses
Application & End-users
- AI&ICT/Computing/Automotive/
Electronics Manufacturers, Investors & R&D
- VC/CVC, Academic & Research Institutes
Dates & Time
August 26 - August 28, 2026
Day 1 : August 26, 2026 | 10:00-17:00
Day 2 : August 27, 2026 | 10:00-17:00
Day 3 : August 28, 2026 | 10:00-16:30
Registration
Pre-registration
1) Web/Mobile Pre-registration
2) Receive Barcode
3) Visit “Self Desk”, Scan your Barcode
4) Pick up the badge
5) Check and enter
*Free Admission
On-site Registration
1) Visit “On-site Registraion Desk”
2) QR Code scan
3) Fill in registration form and submit
4) Payment for Ticket
(Admission Fee: KRW 10,000)
5) Pick up the badge
6) Check and enter
Invitation Card
1) Visit “On-site Registraion Desk”
2) QR Code scan
3) Fill in registration form and
Submit an invitation card
4) Pick up the badge
5) Check and enter
*Free Admission
Exhibits
Semiconductor Packaging & Test Equipment
Semiconductor Packaging Materials, Parts & Thermal Management Solutions
Semiconductor Packaging Technical Solutions & EDA Software
Semiconductor Packaging Glass Substrate & Processing Materials, Equipment
System Semiconductor (Fabless) Design & IP for Advanced Packaging
Other Wafer Processing Materials, Parts, and Equipment
Concurrent Events
Semiconductor Packaging Trend Forum, ISES Korea, Symposium , Exhibitor Tech Seminar & Etc.